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| Layer count | 1~42 layers |
| Laminates type | FR-4,CEM-1,CEM-3,BT Resin, Teflon,PTFE, |
| Rogers,Aluminium,Berquist, Thermagon,Alon.Polyclad | |
| Board thickness | Min. 0.2mm, Max. 8.0mm |
| Base copper thickness | Mass production: |
| Min: 12um (1/3oz) | |
| Max: 140um (4oz) for inner layer; 350um(10oz)for outer layer | |
| Prototype: | |
| Max: 210um (6oz) for inner layer; 450um(13oz) for outer layer | |
| Min finished hole size | By mechanical drilling: 0.15mm (0.006") |
| By laser drilling: 0.05mm (0.002") | |
| Aspect ratio | 12:01 |
| Max panel size | Mass production, 540mm × 740m (21.25" × 29.13") |
| Sample: 700mm × 1100mm (27.56" × 43.3") | |
| Min line width/space | Mass production: 3mil/3mil |
| Prototype: | |
| Inner layer: 0.0635mm/0.0635mm (0.0025"/0.0025") | |
| Outer layer: 0.0585mm/0.0585mm (0.0023"/0.0023") | |
| Via hole type | Blind/Burried/Plugged |
| HDI/Microvia | YES |
| Surface finish | HASL / Lead Free HASL |
| Immersion Gold / Silver / Tin | |
| Flash Gold. Hard Gold plating | |
| Selective thick Gold Plating | |
| Gold Finger (Gold thickness up to 3um) | |
| Plating Silver (Silver through Hole, | |
| Carbon ink, Peelable mark, OSP | |
| Solder mask | All kinds of colour |
| LPI, Dry Film | |
| Min S/M pitch (LPI): 0.1mm | |
| Impedance Control | Single trace or differential controlled |
| 50, 60, 70, 100, 110, 120, 130 ±5% | |
| Min bonding pitch | 0.181mm (center to center) |
| Min SMT pitch | 0.400mm (center to center) |
| Min annular ring | 0.025mm |
| Outline finish type | CNC Routing; V-Scoring/Cut; Punch |
| Tolerances | Min Hole registration tolerance (NPTH) ± 0.025mm |
| Min Hole registration tolerance (PTH) ± 0.075mm | |
| Min Pattern registration tolerance ± 0.05mm | |
| Min S/M registration tolerance (LPI) ± 0.075mm | |
| Scoring Lines ± 0.15mm | |
| Board thickness (0.1 -1.0mm ) ±15% | |
| Board thickness (1.0 -6.35mm ) ±10% | |
| Board Size Routed ± 0.1mm | |
| Board Size Scored ± 0.2mm | |
| Electrical Testing | Voltage 10V - 250V |
| Continuity 10-1000 Ohms |
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3000
Company Size
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5000
Serving Customers
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98
Team
Integrity, efficiency, progress, and innovation
Teson Tech Corp.,Limited offers all kinds of special high technology of multi-layer circuits such as Backplane PCB、Metal base PCB、Hi-Tg heavy copper foil PCB、Flat winding PCB、High frequency PCB、Mixed Dielectric base PCB、Flex and flex-rigid.