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Item
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Volume
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Prototype/Small volume
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PCB specification |
Length x Width | Minimum | 50 x 30mm | L<50mm?or?W<30mm |
| Maximum | 510 x 460mm | 800>L>510mm | ||
| Thickness | Minimum | 0.2mm | ||
| Maximum | 5mm | T>5mm | ||
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PCB specification of DIP operation |
Length x Width | Minimum | 50 x 30mm | L<50mm |
| Maximum | 510 x 460mm | 1000>L>510mm | ||
| Thickness | Minimum | 0.4mm | ||
| Maximum | 5mm | T>5mm | ||
| Specification of SMT component | Outline size | Min. specifications | 0603(0201) | 0602(01005) |
| Max. size | 45 x 45mm | 68x68mm(45x150mm) | ||
| Thickness of component | 25.4mm | T>25.4mm | ||
| QFP/SOP/SOJ/IC Socket etc. | Min. distance of PIN | Pitch=0.4mm | Pitch=0.3mm | |
| CSP, BGA | Min. distance of BGA ball | Pitch=0.5mm | Pitch=0.3mm | |
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3000
Company Size
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5000
Serving Customers
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98
Team
Integrity, efficiency, progress, and innovation
Teson Tech Corp.,Limited offers all kinds of special high technology of multi-layer circuits such as Backplane PCB、Metal base PCB、Hi-Tg heavy copper foil PCB、Flat winding PCB、High frequency PCB、Mixed Dielectric base PCB、Flex and flex-rigid.